Smart Machine Platform Initiative - SMPI

A Partnership with Manufacturers, TechSolve, and U.S. Army Benét Laboratories

In order to meet 21st century manufacturing demands, next generation machining technology must have the capability to modify and optimize instructions prior to execution. This optimization through adjustment will be based on in-situ sensing and control logic systems that understand current equipment condition and process parameters to generate new instructions for the optimized manufacturing process, "smart" machines.

The smart machine effort will focus on addressing intelligent machining processes, measurement, and control challenges from a system science-based perspective working towards a "First Part Correct" philosophy. This term refers to the goal of manufacturing a defect-free component from the first to the last part produced.

The involvement of industry and manufacturers in planning, developing, and execution stages of the development will expedite the transfer of technology and its commercialization by and to the manufacturing community. The result will be the enhancement of US manufacturing competitiveness by increasing the technology lead on global competition.

In December 2005, the SMPI effort was awarded $2 million in federal funds by the Department of Defense through the U.S. Army Benét Laboratories to begin this critical effort to research and develop the next generation of manufacturing processes.